UV LED Spot Light Source 365nm

• IP Rating: IP67
• Certification: CE, RoHS
• Wavelength: 365/385/395nm
• Transport Package: 1set
• Specification: M
• Trademark: UVTaoYuan
• Model NO.: TY-S-365nm-3W
• Origin: China
• HS Code: 9405409000
• Production Capacity: 50, 000 PCS/Year

Product Description

Parameter	Value
Wavelength (nm)	365/385/395/405/415nm
Aluminum plate Size	Φ20mm
Forward current	500-700mA
Forward voltage	3.2-3.6V
Calculated Minimum Radiometric Power 500mA	2000-3000mW
Angle	60°/120°
LED Junction Temperature	60/125ºC

UV LED Spot Light Source 365nm Product Description
Dimensions: L160mm * W100mm * H146mm
Display window: LCD color LCD display
Irradiation method: Fixed irradiating irradiation power (0 to 100%), the irradiation time (up to 999.9 seconds)
Irradiating step ladder mode, and each channel can be set to eight stages of energy output
Total irradiation energy value (in units of MJ, J represents)
Terminal input and output: Input emergency stop, UV irradiation start / end (4 channels), output preparation completion output (4 channels), UV irradiation output, error output
RS-232C (COM) serial input-output UV irradiation start / end (4 channels), setting the parameter acquiring / changing the parameter save / read, set the power / time operation
Cooling: Nature / fan cooling
Weight (package state) about 3500g (Host: about 1500g)
Natural straight irradiation head type / with fan
Cooling / Fan (using magnetic levitation motor) Cooling
Wavelength 365nm
Spot diameter ∮3, irradiation distance 9mm, peak (irradiation intensity) 10000mw / cm2
Spot diameter ∮4, irradiation distance 10mm, peak (irradiation intensity) 8000mw / cm2
Product Data Sheet:Application
Research - photocatalysis, light excitation, photosynthesis and various scientific experiments. Optical Industry - cemented lens and lens groups, prisms, optical engine assembly; microscopes, endoscopes, infrared instrument, night vision equipment, the probe assembly. Optical communications industry - passive devices (various structural bonding or potting glass package tiny element fixed) bonding. Active devices (coaxial devices, laser collimator) bonding. Microelectronics and semiconductor industry -LEC liquid potting Pin FPC adhesively fixed, sensor production, handset components assembly, hard drive head assembly, motors and components assembly, components (capacitors, inductors, a variety of plug-ins, screws, chips, etc.) precision electronics manufacturing. Medical industry - a variety of catheters and instruments of precision adhesive bonding.